Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films

ABSTRACT

Disclosed herein are purified surfactant formulations including purified short-chain fluorosurfactant and iodide additive and a two-part coating kit having the same and a silver nanowire formulation.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/523,113 filed Apr. 28, 2017, now pending; which claims the benefitunder 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No.62/075,733, filed Nov. 5, 2014, which application is incorporated hereinby reference in their entireties.

BACKGROUND Technical Field

The disclosure relates to manufacturing light-stable transparentconductive films using a fluorosurfactant.

Description of the Related Art

Transparent conductive films are essential components in flat paneldisplay devices such as a touch screen or a liquid crystal display(LCD). Using a solution-based format, it is possible to produce robusttransparent conductive films on large area, flexible substrates.

Coating compositions or ink comprising conductive nanostructures (e.g.,silver nanowires) can be coated on a wide range of rigid and flexiblesubstrates to provide transparent conductive thin films or coatings.When suitably patterned, nanowire-based transparent conductors are usedas transparent electrodes or thin film transistors in flat panelelectrochromic displays such as liquid crystal displays (LCD), plasmadisplays, touch panels, electroluminescent devices such as organic lightemitting diode (OLED), thin film photovoltaic cells (PV), and the like.Other applications of the nanowire-based transparent conductors includeanti-static layers and electromagnetic wave shielding layers.Conventional printing processes such as continuous roll-to-roll printingcan be adopted in coating conductive nanostructures to further reducemanufacturing cost and improve throughput.

Co-pending and co-owned U.S. Pat. Nos. 8,048,333, 8,709,125, 8,760,606,8,632,700 and 8,815,126, as well as U.S. Published Patent ApplicationNos. 2010/0307792 and 2013/0001478 describe various approaches forsynthesizing conductive nanowires (e.g., silver nanowires), preparingconductive films via a number of coating or printing methods. Thesedocuments are incorporated herein by reference in their entireties.

Depending on the coating methods, nanowire ink compositions are oftenformulated to address specific requirements such as ink stability,wettability and film defect control.

BRIEF SUMMARY

Provided here are aqueous coating compositions (ink) comprisingconductive nanostructures (including silver nanowires) and short-chainfluorosurfactant.

One embodiment provides a purified surfactant formulation comprising

(1) a short-chain fluorosurfactant represented by Formula (I):

(2) an impurity represented by Formula (II) at an amount of less thanabout 3% by weight of the short-chain fluorosurfactant,

and(3) an iodide additive providing iodide at an amount of about 0.5-2.5%of the short-chain fluorosurfactant,wherein,m is 0, 1, 2, 3, 4 or 5;n is 1, 2, 3, or 4;X is —O—; —S—; or a direct bond;Y is hydrogen, —OH or fluoro;Z is —CH₃, —CH₂F, —CHF₂ or —CF₃;M⁺ is Li⁺, Na⁺, K⁺, H⁺ or NH₄ ⁺; andR₁, R₂, R₃, R₄ and R₅, at each occurrence, are the same or different andindependently fluoro or hydrogen.

A further embodiment provides a two-part kit for coating silvernanowires, comprising:

-   (1) a first container including a nanowire formulation including: a    plurality of silver nanowires; a viscosity modifier; an optional    dispersant; and a liquid carrier including water; and-   (2) a second container including a purified surfactant formulation    describe herein, wherein, the nanowire-containing formulation    comprises silver ions at an amount of 0.005-0.02% per 1% of the    silver nanowires by weight; and the purified surfactant formulation    comprises iodide ions at an amount of about equimolar of the silver    ions of nanowire-containing formulation.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 shows the sheet resistance changes of conductive films over timeunder various reliability testing conditions.

FIG. 2 shows the sheet resistance changes of conductive films over timeunder accelerated light condition.

DETAILED DESCRIPTION

Aqueous coating compositions for coating conductive nanostructures(including silver nanowires) are described herein. The coatingcomposition (or “ink”) further includes a fluorosurfactant, whichfacilitates dispersing, stabilizing and wetting of the coatingcomposition.

Fluorosurfactants, also known as perfluorinated surfactants, aresurfactants containing a plurality of fluoro substituents (“perfluo”),which typically have replaced the hydrogens of a hydrocarbon chain.Certain fluorosurfactants, including ZONYL® FSA (by DuPont), are knownto be used in coating compositions of conductive nanostructures. Seee.g., U.S. Pat. No. 8,632,700. However, the known fluorosurfactantsgenerally have long carbon chains (i.e., at least 7 or 8 fluoro-bearingcarbons). These long-chain fluorosurfactants have exceptionally longhalf-lives. Thus, there are considerable concerns over thebioaccumulation and environmental persistence of these materials.

This disclosure is thus directed to short-chain fluorosurfactants thathave much lower environmental impact than the long-chainfluorosurfactants currently used in the art.

It has been discovered that better storage stability can be achievedwhen the silver nanowires and the fluorosurfactant are storedseparately, only to be combined shortly before coating. Thus, theshort-chain fluorosurfactant is formulated into a surfactantformulation, which is to be added to a nanowire-containing formulationto form a final coating composition that is ready to coat.

In addition, the short-chain fluorosurfactants are purified to minimizeimpurities that may passivate the conductive nanostructures. Inparticular, certain reactants for preparing the short-chainfluorosurfactants contain functional groups (e.g., —SH) that haveaffinity for the conductive nanostructures (e.g., silver nanowires),thus forming a passivating layer that impedes wire-wire contacts andreduces conductivity.

Moreover, the fluorosurfactant formulation further comprises an iodideadditive in an amount effective for forming light-stable conductivefilms. While not being bound by any theories, it is believed that atrace amount of silver ions (Ag+), which is found to be proportional tothe amount of silver nanowires in the nanowire formulation, mayultimately contribute to silver nanowire degradation in the conductivefilm due to ionic migration. The iodide additive is believed toeffectively bound to silver ions to produce silver iodide (AgI), thusimmobilizing the silver ions.

One embodiment is thus directed to a purified surfactant formulationcomprising

(1) a short-chain fluorosurfactant represented by Formula (I):

(2) an impurity represented by Formula (II) at an amount of less thanabout 3% by weight of the short-chain fluorosurfactant:

and(3) an iodide additive providing iodide at an amount of about 0.5-2.5%of the short-chain fluorosurfactant,wherein,m is 0, 1, 2, 3, 4 or 5;n is 1, 2, 3, or 4;X is —O—; —S—; or a direct bond;Y is hydrogen, —OH or fluoro;Z is —CH₃, —CH₂F, —CHF₂ or —CF₃;M⁺ is Li⁺, Na⁺, K⁺, H⁺ or NH₄ ⁺; andR₁, R₂, R₃, R₄ and R₅, at each occurrence, are the same or different andindependently fluoro or hydrogen.

More specifically, in certain embodiments, there are no more than 6fluoro-bearing carbons in the fluorosurfactant of Formula (I).“Fluoro-bearing carbon” means a carbon atom substituted with at leastone fluoro.

In preferred embodiments, there are 4, 5 or 6 fluoro-bearing carbons.

In preferred embodiments, X is a direct bond.

In preferred embodiments, Y is —OH.

In preferred embodiments, Z is —CF₃.

In certain embodiments, m is 6 and n is 2.

In some embodiments, the impurity of Formula (II) is a thiol-containingalkonoic acid (e.g., R₄ and R₅ are hydrogen, M is H). The length of thealkonoic acid depends on n.

In preferred embodiments, the short-chain fluorosurfactant has 6fluoro-bearing carbons and is commercially available under the tradename of Hexafor612N (Maflon, Bergamo Italy).

Hexafor612N from the commercial source generally has, depending on thelot, 8,000-20,000 ppm of a thiol-containing impurity in a solution of25% surfactant.

In particular, the thiol-containing impurity is 3-mercaptopropionicacid. i.e., Formula (II) wherein n is 2, M is H, R₄ and R₅ are hydrogen.

To purify the fluorosurfactant, the impurity of Formula (II) may beremoved by first converting the fluorosurfactant into an insoluble acidform (M is H), thereby separating the acid-form of the fluorosurfactantfrom the impurity. The acid-form is then converted back to a proper saltform (e.g., M⁺ is Li⁺). Details of the purification are furtherdescribed in Example 1.

Thus, a purified fluorosurfactant formulation has an impurity of Formula(II) of less than about 3% by weight of the fluorosurfactant.

In preferred embodiments, the thiol-containing impurity is less thanabout 2%, or less than about 1.5%, or less than about 1%, or less thanabout 0.5%, or less than about 0.2% of the fluorosurfactant by weight.

In a preferred embodiment, the thiol-containing impurity is less thanabout 0.4% of the fluorosurfactant. Thus, in a 25% surfactant solution,the impurity is less than 1000 ppm.

As used herein, “about” refers to a possible deviation of up to ±25%from a specified value. For example, “about 2.5%” may include any valuefrom 2.5% up to 3.125% (i.e., 2.5%×1.25), or any value from 2.5% to1.875% (i.e., 2.5%×0.75). Additional, “about equimolar” may include anyvalue from 1:1 molar ratio to 0.75:1 up to 1.25:1 molar ratio.

The fluorosurfactant formulation further comprises an iodide additivethat provides iodide at an amount of about 0.5-2.5% of the short-chainfluorosurfactant. Suitable iodide additives are water soluble iodidesalts that preferably can at least partially dissociate into free iodideions in water. Examples include lithium iodide (LiI), sodium iodide(NaI), potassium iodide (KI), ammonium iodide (NH₄I) and the like.Although iodide salts that are freely dissociable in water are preferred(e.g., LiI), complete dissolution in water is not strictly requiredbecause silver iodide formation is thermodynamically favorable to mostother iodide salts.

In preferred embodiments, the amount of the iodide in thefluorosurfactant formulation is about 0.6-2.4% by weight of thefluorosurfactant. Thus, in a fluorosurfactant formulation that has 25%by weight of the fluorosurfactant, the iodide is in a concentration of1500-6000 ppm.

In various embodiments, the amount of the iodide could be 0.5%, 0.6%,0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%,1.9%, 2%, 2.1%, 2.2%, 2.3%, 2.4% or 2.5% by weight of thefluorosurfactant.

The amount of the iodide in the fluorosurfactant formulation iscalibrated to correspond to an amount of silver ions in the nanowireformulation. Generally speaking, the amount of the iodide should beabout equimolar to the silver ions. The iodide is thus intended to bindto silver ions to form silver iodide, thereby reducing silverdegradation due to ionic migration.

As demonstrated in the Examples here, the presence of iodide in thecoating solution clearly gives rise to long-term film reliability (e.g.,no or little sheet resistance drift after a prolong period of lightexposure). There is an additional yet unexpected benefit when the iodideis combined with the nanowires shortly before coating (e.g., within 2hours). It is discovered that the presence of the un-sequestered silverions during the coating process provide films with fewer defects (e.g.,bubbles). It is therefore speculated that the silver ions likelyfacilitate wire dispersion (e.g., due to ionic repulsion), therebyimproving coating quality.

A further embodiment thus discloses a two-part kit for coating silvernanowires, comprising:

a first container including a nanowire formulation including:(1) a plurality of silver nanowires;(2) a viscosity modifier;(3) an optional dispersant; and(4) a liquid carrier including water;a second container including a purified surfactant formulation describedabovewherein, the nanowire-containing formulation comprises silver ions at anamount of 0.005-0.02% per 1% of the silver nanowires by weight; and

the purified surfactant formulation comprises iodide ions at an amountof about equimolar of the silver ions of nanowire-containingformulation.

The silver nanowires preferably are no more than 30 nm in diameter, andare more than 5 μm long. In various embodiments, the silver nanowireshave mean diameter of between about 21 and 23 nm and a standarddeviation in the range of 3 to 4 nm. In other embodiments, the silvernanowires have a mean length of about 12-20 μm and a standard deviationof about 6 to 8 μm. The silver nanowires may be prepared by a methoddescribed in co-pending, co-owned U.S. Patent Application PublicationNo. 2015/0290715, which application is incorporated herein by referencein its entirety.

In various embodiments, the viscosity modifier may be a hydrophilicpolymer, including for example, hydroxypropyl methyl cellulose (HPMC),methyl cellulose, xanthan gum, polyvinyl alcohol, carboxy methylcellulose, and hydroxy ethyl cellulose.

In various embodiments, the ratio of the silver nanowires and theviscosity modifier is in the range of 0.00626 to 5. In preferredembodiments, the ratio is in the range of 0.1-1. In a preferredembodiment, the ratio is in the range of 0.4-0.5.

In various embodiments, the nanowire formulation optionally includes adispersant. The dispersant may be the same or different from thepurified fluorosurfactant in the second container. Preferably, thedispersant should not contain any iodide, to ensure that the iodidesource of the final coating composition is solely from thefluorosurfactant formulation in a controlled amount. Examples of thedispersant in the nanowire formulation may be a surfactant sold underthe trade name FS-3100 (DuPont).

The liquid carrier contains water. In various embodiments, the liquidcarrier may further contain one or more water-miscible cosolvents,including isopropanol, acetone, diacetone alcohol, and the like.

The nanowire formulation may be concentrated (i.e., “ink concentrate”)and it can be diluted before being combined with the fluorosurfactantformulation, which process will dilute the ink concentrate even further.

In various embodiments, after dilution of the ink concentrate andcombination with the fluorosurfactant, the final coating compositionincludes, by weight, from 0.05% to 1.4% metal nanowires, from 0.0025% to0.1% fluorosurfactant, from 0.02% to 4% viscosity modifier, from 94.5%to 99.0% liquid carrier.

The final coating composition may be coated on a substrate by slot-die,spin-coating or roll-to-roll coating methods. “Substrate” refers to anon-conductive material onto which the metal nanostructure is coated orlaminated. The substrate can be rigid or flexible. The substrate can beclear or opaque. Suitable rigid substrates include, for example, glass,polycarbonates, acrylics, and the like. Suitable flexible substratesinclude, but are not limited to: polyesters (e.g., polyethyleneterephthalate (PET), polyester naphthalate, and polycarbonate),polyolefins (e.g., linear, branched, and cyclic polyolefins), polyvinyls(e.g., polyvinyl chloride, polyvinylidene chloride, polyvinyl acetals,polystyrene, polyacrylates, and the like), cellulose ester bases (e.g.,cellulose triacetate, cellulose acetate), polysulfones such aspolyethersulfone, polyimides, silicones and other conventional polymericfilms. Additional examples of suitable substrates can be found in, e.g.,U.S. Pat. No. 6,975,067.

Following coating, the volatile components, including water and anyco-solvents, are removed by evaporation or baking. The non-volatilecomponents, including silver nanowires, viscosity modifier andshort-chain fluorosurfactant form a nanowire layer in which the silvernanowires form a conductive network. The nanowire layer may be furtherprocessed into an optical stack, including being overcoated by anovercoat layer, or bonded to another layer by an optically clearadhesive (OCA).

In certain embodiments, the overcoat includes additives that stabilizethe underlying silver nanowires. In certain embodiments, the additivesare transition metal complexes (e.g., Fe(acac)₃) as described in U.S.Patent Application Publication No. 2015/0270024, which is incorporatedby reference in its entirety.

Typically, the optical transparence or clarity of the transparentconductor (i.e., a conductive network on a non-conductive substrate) canbe quantitatively defined by parameters including light transmission andhaze. “Light transmission” refers to the percentage of an incident lighttransmitted through a medium. In various embodiments, the lighttransmission of the conductive layer is at least 80% and can be as highas 98%. Performance-enhancing layers, such as an adhesive layer,anti-reflective layer, or anti-glare layer, may further contribute toreducing the overall light transmission of the transparent conductor. Invarious embodiments, the light transmission (T %) of the transparentconductors can be at least 50%, at least 60%, at least 70%, or at least80% and may be as high as at least 91% to 92%, or at least 95%.

Haze (H %) is a measure of light scattering. It refers to the percentageof the quantity of light separated from the incident light and scatteredduring transmission. Unlike light transmission, which is largely aproperty of the medium, haze is often a production concern and istypically caused by surface roughness and embedded particles orcompositional heterogeneities in the medium. Typically, haze of aconductive film can be significantly impacted by the diameters of thenanostructures. Nanostructures of larger diameters (e.g., thickernanowires) are typically associated with a higher haze. In variousembodiments, the haze of the transparent conductor is no more than 10%,no more than 8%, or no more than 5% and may be as low as no more than2%, no more than 1%, or no more than 0.5%, or no more than 0.25%.

The transparent conductor structures, their electrical and opticalproperties, and the methods of patterning are illustrated in more detailby the following non-limiting examples.

EXAMPLES Example 1

Purification of Short-Chain Fluorosurfactant

Impurities present in certain fluorosurfactant can have a negativeimpact on coating performance. One known impurity in commercialshort-chain fluorosurfactant (Hexafor612N) is unreacted3-mercaptopropionic acid which can passivate silver nanowires, therebyrendering the network non-conductive due to poor wire to wire contact.Purifying the incoming raw material can ensure that all components thatnegatively interact the nanowire network formation are removed prior toformulating the final coating composition. It also ensures that allcoating constituents are reliable with lot-to-lot consistency.

Hexafor612N was purified by converting its acetate salt to an acid form.A strong acidic solution was first prepared by adding 110 g of 70%nitric acid (EMD, Darmstadt Germany) into 12 kg of water in a vessel.Thereafter, 2 kg of Hexafor612N (Maflon, Bergamo Italy) was added to thevessel containing DI water and acid at a rate of 50-60 ml/minute andstirred at 140 rpm. The acid form of Hexafor612N was insoluble in DIwater and precipitated into solid. Water and impurities were thendecanted from the precipitate and the solid was additionally washed byadding 3 kg of DI water and mixed at 140 rpm for 15 minutes followed bydecantation of the fluid to further solubilize impurities as well asnitrate introduced in the acidification step. Next the solid precipitatewas dissolved into 0.175 kg IPA (Ultrapure Solutions, Castroville CA)which produced a two-phase solution of an organic layer consisting ofIPA and dissolved Hexafor612N acid and small percentage of water andseparate aqueous layer consisting of DI water and small percentage ofIPA. The DI water layer was removed and then an additional 0.864 kg ofIPA is added followed by adding 0.403 kg of 5% of 99.995% LiOH (AlfaAesar, Ward Hill, Mass.) in DI water to convert the Hexafor612N acidback to its salt form. This process produces a solution of purified 25%Hexafor612N lithium salt, the remainder of the solution being a 50%IPA/25% H₂O solution.

Example 2

Purified Fluorosurfactant Formulation with Iodide Additive

0.1341 kg of 99.995% lithium Iodide (Aldrich, St Louis Mo.) was added tothe purified 25% Hexafor612N in 50% IPA/25% H₂O solution of Example 1and stirred for 30 minutes at 140 rpm. The resulting fluorosurfactantformulation contains 4500 ppm of LiI.

Example 3

Ink 1 Formulation with Purified 25% Hexafor612N and 4500 ppm LiI

0.735 kg of an ink concentrate containing 0.136% Ag, 0.28% Methocell 311Binder (Dow Chemical, Midland Mich.), and 175 ppm FS-3100 (DupontWilmington, Del.) was first diluted by adding 1.264 kg of DI water. Thediluted solution was mixed for 5 minutes at 500 rpm.

0.0028 kg of a fluorosurfactant formulation containing purified 25%Hexafor612N (Maflon, Bergamo Italy) and 4500 ppm Lithium Iodide (SigmaAldrich, St Louis Mo.) was added to the above diluted solution and mixedfor 10 minutes at 500 rpm to form a final coating composition (“Ink 1”).

Example 4

Ink 2 Formulation with Unpurified 25% Hexafor612N and 4500 ppm LiI

0.735 kg of an ink concentrate containing 0.136% Ag, 0.28% Methocell 311Binder (Dow Chemical, Midland Mich.), and 175 ppm FS-3100 (DupontWilmington, Del.) was first diluted by adding 1.264 kg of DI water. Thediluted solution was mixed for 5 minutes at 500 rpm.

0.0028 kg of a fluorosurfactant solution containing unpurified 25%Hexafor612N (Maflon, Bergamo Italy) and 4500 ppm Lithium Iodide (SigmaAldrich, St Louis Mo.) was added to the above diluted solution and mixedfor 10 minutes at 500 rpm to form a final coating composition (“Ink 2”).

Example 5

Comparative Results of Conductive Films Formed from Ink 1 and Ink 2

Ink 1 and Ink 2 were separately coated on a slot die roll-to-rollcoating system on a PET film (e.g., MELINEX-454 or TORAY U483). Each inkwas degassed prior to coating at −28 “Hg for 30 minutes. Each ink wasthen coated at a flow rate of 15 ml/min. and dried at 40° C., 60° C. and90° C. for 1 minute each. After drying, the sample was laminated at 2MPa pressure.

Film samples from each coating were measured for sheet resistance with anon-contact conductance meter and % Haze was measured using anintegrating sphere. The results are in the table below:

Ink 1 Ink 2 (purified Hexafor612N) (unpurified Hexafor612N) SheetResistance 130 ohm/square Non-conductive % Haze 1.58 1.58

As demonstrated, films formed from Ink 2, which contained unpurifiedHexafor612N, produced a non-conductive film due to the passivatingimpurities. In contrast, Ink 1, which differed from ink 2 only in thatHexafor612N was purified before formulation, produced a conductivenetwork with satisfactory sheet resistance and haze properties.

Example 6

Reducing Coating Defects

This example demonstrates that defect levels were significantly reducedwith short-chain fluorosurfactant as compared to ZONYL®FSA.

Bubble defects and particle defects in transparent conductor thin filmscan be very problematic. During the touch panel production, defects inpatterned lines can cause shorting or reliability issues, which reducesyield and negatively impacts the manufacturing worthiness. Theshort-chain fluorosurfactants (including Hexafor612N) described hereinhave a much lower propensity for bubble defects in nanowire inks thanZONYL®FSA in the art. In addition, purified Hexafor612N also reducedparticle defect levels.

Ink 1 and Ink 2 were prepared according to Examples 3 and 4,respectively.

In addition, Ink 3 with Zonyl FSA was prepared by first diluting an inkconcentrate containing 0.136% Ag, 0.28% Methocell 311 Binder (DowChemical, Midland Mich.), and 175 ppm FS-3100 (Dupont Wilmington, Del.)by adding 1.264 kg of DI water to 0.735 kg of the ink concentrate in a 4L Nalgene bottle and mixing. Thereafter, 0.0021 kg of a solutioncontaining 25% Zonyl® FSA (Dupont Wilmington, Del.) was added to thediluted solution (ink concentrate and water) and mixed for 10 minutes.

Each ink was coated separately on a slot die roll to roll coatingsystem. The solution was degassed prior to coating a −28 “Hg for 30minutes. The solution was coated at 15 ml/min. and dried at 40° C., 60°C. and 90° C. for 1 minute each. After drying, the sample was laminatedat 2 MPa pressure.

Film samples were inspected across a 300 mm coating over a 2 meterlength for defects with a video lamp against a black background anddefect levels were listed below:

Particle Defects Bubble Defects/m² Ink 1 2 0 Ink 2 25 0 Ink 3 30 40

These results demonstrate that bubble defects were greatly reduced withthe implementation of the short-chain fluorosurfactant (e.g., Ink 1 andInk 2) In addition, purification of raw materials reduced particledefects by an order of magnitude while keeping bubble counts low (seeInk 1).

It is noted that Zonyl® FSA naturally contains iodide. However, theshort-chained fluorosurfactants performed much better in film formationthan Zonyl® FSA.

Example 7

Stabilizing Effect of Iodide Additive

This example demonstrates that when an anion such as iodide is added tothe final coating composition, the resulting conductive film showsimproved reliability because the iodide ions can bind to silver cations.The reliability testing conditions are, 85° C., dry, ambient room lightand fluorescent light.

It has been discovered that excess free silver cations can bedetrimental to the reliability of bulk silver nanowires in the presenceof light and heat. The addition of an anion such as iodide can bindsilver cations and greatly improve film reliability.

The calculations of the relative amounts of silver cations, silver andiodide are as follows:

[Ag⁺] content: 0.014% Ag⁺ ion per 1% Ag[Ag] of the coating composition is 0.05% Ag, it follows that [Ag+]content was 0.014%*0.05% Ag/1% Ag=0.0007%

Ag⁺ mole=[Ag+]/Ag M.W.=0.0007%/108=6.5*E-8

LiI was added at 4500 ppm in Hexafor612; Hexafor612 was added at 353 ppminto ink; Hexafor612 was 25% concentration

[I⁻]=0.000353/25%*0.004500=6.354*E-6

I− mole=[I−]/I M.W.=6.354*E-6/127=5*E-8

Three ink compositions with different Ag⁺/I⁻ molar ratios were prepared,among which, two (Ink 1 and Ink 5) had close to equimolar of Ag⁺ and I⁻,wherein Ink 4 had no iodide.

More specifically, by the above calculation, Ink 1 of Example 3contained silver cation (Ag⁺) 6.5*E-8 mol and Iodide 5*E-8 mol, givingrise to the following molar ratio: Ag⁺/I⁻ molarratio=6.5*E-8/5*E-8=1.3/1

Ink 4, which had no iodide, was prepared by first diluting 0.735 kg ofan ink concentrate containing 0.136% silver nanowires, 6.5*E-8 molsilver cation, 0.28% Methocell 311 Binder (Dow Chemical, Midland Mich.),and 175 ppm FS-3100 (Dupont Wilmington, Del.) by adding 1.264 kg of DIwater followed by mixing the diluted solution for 5 minutes at 500 rpm.Thereafter, 0.0021 kg of a fluorosurfactant solution containing purified25% Hexafor612N (Maflon, Bergamo Italy) with no added lithium iodide wasadded to the diluted solution and mixed for 10 minutes at 500 rpm.

Ink 5, which has more iodide than Ink 1, were prepared by first diluting0.735 kg of an ink concentrate containing 0.136% Ag, 0.28% Methocell 311Binder (Dow Chemical, Midland Mich.), and 175 ppm FS-3100 (DupontWilmington, Del.) by adding 1.264 kg of DI water followed by mixing thediluted solution for 5 minutes at 500 rpm. Thereafter, 0.0021 kg of afluorosurfactant solution containing purified 25% Hexafor612N (Maflon,Bergamo Italy) with 6000 ppm of lithium iodide (6.6E-8 mole of iodide)was added to the diluted solution and mixed for 10 minutes.

Ink 1, Ink 4 and Ink 5 were separately coated on a slot die roll-to-rollcoating system. Each ink was degassed prior to coating at −28 “Hg for 30minutes. Each ink was then coated at a flow rate of 15 ml/min. and driedat 40° C., 60° C. and 90° C. for 1 minute each. After drying, the samplewas laminated at 2 MPa pressure.

Sample films from each coating were measured for sheet resistance (R)with a non-contact conductance meter and % Haze was measured using anintegrating sphere. The results are in the table below:

Ag⁺/I⁻ (molar ratio) R (ohms/sq) Haze (%) Ink 1 (4500 ppm LiI) 1.3/1 1411.16 Ink 4 (no iodide) No iodide 146 1.15 Ink 5 (6000 ppm LiI) 0.98:1140 1.19

These sample films were placed in reliability testing chamber andexposed to various conditions: control (ambient temperature in the rangeof 20-25° C., ambient fluorescent light); 85° C./dry; 85° C./85% RH; and60° C./90% RH. FIG. 1 shows the sheet resistance changes over time inthese sample films under the testing conditions. As shown, the filmformed of ink 5 (equimolar Ag⁺/I⁻) demonstrates the best reliability,showing negligible drift of sheet resistance (less than 5%) over aperiod of >400 hours under all conditions. Similarly, the film formed ofInk 1 (close to equimolar Ag⁺/I⁻) demonstrates comparable, though less,reliability. Strikingly, the film formed of Ink 4 (having no iodide)demonstrates much faster loss of conductivity (i.e., rapid increase ofsheet resistance) in all testing conditions.

Film samples prepared from Ink 1, Ink 4 and Ink 5 were also tested underaccelerated light condition. Under the accelerated light condition, thelight intensity is typically significantly elevated compared to theoperating light intensity of the given device; the duration of the lightexposure for testing the reliability of the conductive films cantherefore be significantly compressed compared to the normal servicelife of the same device. Typically, light intensity is measured inLumens, which is a unit of luminous flux. Under an accelerated lightcondition, the light is about 30 to 100 times more intense than thelight condition of a device.

FIG. 2 shows that under an accelerated light condition, sample filmprepared from Ink 5 (equal molar of Ag⁺/I⁻) performed significantlybetter than the other samples, especially after the 500 hours mark.

All of the above U.S. patents, U.S. patent application publications,U.S. patent applications, foreign patents, foreign patent applicationsand non-patent publications referred to in this specification and/orlisted in the Application Data Sheet, are incorporated herein byreference, in their entirety.

1. A coating composition comprising: conductive nanostructures; and apurified surfactant formulation comprising: a short-chainfluorosurfactant represented by Formula (I):

an impurity represented by Formula (II) at an amount of less than about3% by weight of the short-chain fluorosurfactant,

and an iodide additive providing iodide at an amount of about 0.5-2.5%of the short-chain fluorosurfactant, wherein, m is 0, 1, 2, 3, 4 or 5; nis 1, 2, 3, or 4; X is —O—; —S—; or a direct bond; Y is hydrogen, —OH orfluoro; Z is —CH₃, —CH₂F, —CHF₂ or —CF₃; M⁺ is Li⁺, Na⁺, K⁺, H⁺ or NH₄⁺; and R₁, R₂, R₃, R₄ and R₅, at each occurrence, are the same ordifferent and independently fluoro or hydrogen.
 2. The coatingcomposition of claim 1, wherein the short-chain fluorosurfactantrepresented by Formula (I) has no more than 6 fluoro-bearing carbons. 3.The coating composition of claim 1, wherein X is a direct bond.
 4. Thecoating composition of claim 1, wherein Y is —OH.
 5. The coatingcomposition of claim 4, wherein Z is —CF₃.
 6. The coating composition ofclaim 1, wherein m is 6 and n is
 2. 7. The coating composition of claim1, wherein the impurity represented by Formula (II) is less than about0.4% of the short-chain fluorosurfactant.
 8. The coating composition ofclaim 1, wherein the iodide in the fluorosurfactant formulation is about0.6-2.4% by weight of the short-chain fluorosurfactant.
 9. The coatingcomposition of claim 1, wherein the conductive nanostructures comprisesilver nanowires.
 10. The coating composition of claim 9, furthercomprising viscosity modifier, wherein a ratio of the silver nanowiresand the viscosity modifier is in the range of about 0.00626 to about 5.11. The coating composition of claim 9, wherein the coating compositioncomprises silver ions at an amount of 0.005-0.02% per 1% of the silvernanowires by weight.
 12. The coating composition of claim 11, whereinthe iodide ions at an amount of about equimolar of the silver ions. 13.The coating composition of claim 9, wherein silver nanowires are no morethan 30 nm in diameter, and are more than 5 μm long.
 14. The coatingcomposition of claim 1, further comprising dispersant.
 15. The coatingcomposition of claim 1, further comprising liquid carrier.
 16. Thecoating composition of claim 15, wherein the liquid carrier compriseswater or water-miscible cosolvents.
 17. A coating compositioncomprising: from 0.05% to 1.4% by weight of conductive nanostructures;from 0.02% to 4% by weight of a viscosity modifier; from 94.5% to 99.0%by weight of a liquid carrier; and from 0.0025% to 0.1% by weight of apurified surfactant formulation comprising: a short-chainfluorosurfactant represented by Formula (I):

an impurity represented by Formula (II) at an amount of less than about3% by weight of the short-chain fluorosurfactant,

and an iodide additive providing iodide at an amount of about 0.5-2.5%of the short-chain fluorosurfactant, wherein, m is 0, 1, 2, 3, 4 or 5; nis 1, 2, 3, or 4; X is —O—; —S—; or a direct bond; Y is hydrogen, —OH orfluoro; Z is —CH₃, —CH₂F, —CHF₂ or —CF₃; M⁺ is Li⁺, Na⁺, K⁺, H⁺ or NH₄⁺; and R₁, R₂, R₃, R₄ and R₅, at each occurrence, are the same ordifferent and independently fluoro or hydrogen.
 18. The coatingcomposition of claim 17, wherein the impurity represented by Formula(II) is less than about 0.4% of the short-chain fluorosurfactant. 19.The coating composition of claim 17, wherein the iodide in thefluorosurfactant formulation is about 0.6-2.4% by weight of theshort-chain fluorosurfactant.
 20. The coating composition of claim 17,wherein the conductive nanostructures comprise silver nanowires.